Thermoelectric properties of aluminum compound-doped α-SiC ceramics

被引:4
作者
Pai, Chul-Hoon [1 ]
机构
[1] Incheon Natl Univ, Dept Nanobioengn, Inchon 406772, South Korea
关键词
alpha-SiC; AlN; Al4C3; Electrical conductivity; Seebeck coefficient; Thermal conductivity; Figure of merit;
D O I
10.2109/jcersj2.122.870
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The effects of aluminum compound additive on the thermoelectric properties of alpha-SiC ceramics were studied. Porous SiC ceramics with 50-60% relative density were fabricated by sintering the pressed alpha-SiC powder compacts with AlN and/or Al4C3 at 2150 degrees C for 3 h in Ar atmosphere. The sintered bodies were analyzed by means of XRD, SEM, and TEM. The lattice parameter measurements revealed incorporation of a certain amount of added Al and/or N into the SiC lattice. 6H to 4H reverse phase transformation occurred during sintering. The Seebeck coefficient, electrical conductivity and thermal conductivity were measured at 550-950 degrees C in Ar and/or vacuum atmosphere. The kind of additives and the amount of addition had significant effects on the thermoelectric properties. The thermoelectric figure of merit of aluminum compound-doped SiC increased with increasing temperature and was lower than that of n-type SiC. On the whole, AlN-doped SiC had higher figure of merit than Al4C3-doped SiC. (C) 2014 The Ceramic Society of Japan. All rights reserved.
引用
收藏
页码:870 / 875
页数:6
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