共 14 条
- [1] Pinning effect on punched-out dislocations in silicon wafers investigated using indentation method [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1997, 36 (11A): : L1422 - L1425
- [2] The analysis of bending stress and mechanical property of ultralarge diameter silicon wafers at high temperatures [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (07): : 3799 - 3806
- [4] THE RELATIONSHIP BETWEEN THE BENDING STRESS IN SILICON-WAFERS AND THE MECHANICAL STRENGTH OF SILICON-CRYSTALS [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (6A): : 3209 - 3215
- [5] FURUDA T, 1992, APPL PHYS LETT, V60, P1184
- [6] DEFORMATION OF SILICON AT LOW-TEMPERATURES [J]. JOURNAL OF MATERIALS SCIENCE, 1974, 9 (10) : 1569 - 1576
- [7] INDENTATION DISLOCATION ROSETTES IN SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1975, 46 (04) : 1470 - 1472