Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

被引：29

作者：

Dorkel, JM

Tounsi, P

Leturcq, P

机构：

[1] Laboratoire d'Analyse et d'Architecture des Systèmes, C.N.R.S., Toulouse Cedex

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1996年 / 19卷 / 04期

关键词：

plane multilayered systems; 3-D thermal modeling; two-port network theory; transient thermal analysis; thermal design of integrated or hybrid power circuits;

D O I：

10.1109/95.554931

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper recalls how the two-port network theory can be extended to three-dimensional (3-D) conductive heat transfer in multilayered plane structures, Then it is shown how to build efficient computation tools by implementing this theory with help of fast Fourier transform (FFT) algorithms, These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration is given concerning thermal analysis of an insulated gate bipolar power transistor (IGBT) power module and computed results are compared with experiment.

引用

页码：501 / 507

页数：7