The concept of plasma cleaning in glow discharge spectrometry

被引:38
作者
Molchan, I. S. [1 ]
Thompson, G. E. [1 ]
Skeldon, P. [1 ]
Trigoulet, N. [1 ]
Chapon, P. [2 ]
Tempez, A. [2 ]
Malherbe, J. [2 ]
Lobo Revilla, L. [4 ]
Bordel, N. [3 ]
Belenguer, Ph. [5 ]
Nelis, T. [5 ]
Zahri, A. [5 ]
Therese, L. [6 ]
Guillot, Ph. [6 ]
Ganciu, M. [7 ,8 ]
Michler, J. [9 ]
Hohl, M. [9 ]
机构
[1] Univ Manchester, Sch Mat, Ctr Corros & Protect, Manchester M60 1QD, Lancs, England
[2] HORIBA Jobin Yvon, F-91160 Longjumeau, France
[3] Univ Oviedo, Fac Sci, Dept Phys, Oviedo 33007, Spain
[4] Univ Oviedo, Fac Chem, Dept Phys & Analyt Chem, E-33006 Oviedo, Spain
[5] Univ Toulouse 3, UMR 5213, F-31062 Toulouse, France
[6] Univ JF Champollion, ERT 2000, DPHE, F-81012 Albi, France
[7] Natl Inst Lasers Plasma & Radiat Phys, Bucharest 077125, Magurele, Romania
[8] Univ Paris 11, CNRS, Phys Gaz & Plasmas Lab, UMR UPS 8578, F-91405 Orsay, France
[9] Swiss Fed Labs Mat Testing & Res, EMPA, Lab Mech Mat & Nanostruct, CH-3602 Thun, Switzerland
关键词
FLIGHT MASS-SPECTROMETRY; DEPTH PROFILING ANALYSIS; GD-OES; POWERFUL TECHNIQUE; ION-SOURCE; ENERGIES; EMISSION; COATINGS; SOLIDS; GDOES;
D O I
10.1039/b818343k
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
A plasma cleaning procedure to improve elemental depth profiling of shallow layered materials by glow discharge spectrometry is proposed. The procedure is based on two approaches applied prior to depth profiling, either individually or sequentially. The first approach employs a plasma generated at low power, i.e. a "soft'' plasma, for removal of contaminants adsorbed on the surface of the target material. In the second approach, sacrificial material is sputtered under normal conditions, e. g. those used for depth profiling, to clean the inner surface of the anode of the glow discharge source. It is demonstrated that plasma cleaning in glow discharge optical emission spectrometry and glow discharge time-of-flight mass spectrometry improves significantly the spectrum of the target material, particularly at the commencement of sputtering due to stabilisation of the plasma as a result of removal of contaminants. Furthermore, modelling and validation studies confirmed that the soft plasma cleaning does not sputter the target material.
引用
收藏
页码:734 / 741
页数:8
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