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Sub-100 nm triangular nanopores fabricated with the reactive ion etching variant of nanosphere lithography and angle-resolved nanosphere lithography
被引:129
作者:

Whitney, AV
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机构: Northwestern Univ, Dept Chem, Evanston, IL 60208 USA

Myers, BD
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机构: Northwestern Univ, Dept Chem, Evanston, IL 60208 USA

Van Duyne, RP
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机构: Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
机构:
[1] Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
[2] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
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D O I:
10.1021/nl049345w
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Nanosphere lithography (NSL) is combined with reactive ion etching (RIE) to fabricate ordered arrays of in-plane, triangular cross-section nanopores. Nanopores with in-plane widths ranging from 44 to 404 nm and depths ranging from 25 to 250 nm are demonstrated. The combination of angle-resolved nanosphere lithography (AR NSL) and RIE yields an additional three-fold reduction in nanopore size.
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页码:1507 / 1511
页数:5
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