Dynamic self-similar debonding of interface at very high velocity: Anti-plane case

被引:0
作者
Wang, YS
Zhang, ZM
Duo, W
机构
[1] NO JIAOTONG UNIV,INST ENGN MECH,BEIJING 100044,PEOPLES R CHINA
[2] HARBIN INST TECHNOL,SCH ASTRONAUT,HARBIN 150001,PEOPLES R CHINA
来源
ACTA MECHANICA SOLIDA SINICA | 1996年 / 9卷 / 04期
关键词
interface debonding; interface crack; self-similar propagation; transonic; supersonic; dynamic stress intensity factor;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper analyzes the anti-plane problem of dynamic self-similar debonding of interface at very high velocity. The debonding is modeled as an interface crack propagating self-similarly from zero-length. The extending speed is assumed to be transonic or supersonic. We first consider the dynamic debonding under moving concentrated loads. The moving dislocation model of self-similar propagation of an interface crack is used to formulate the problem to a singular integral equation which is solved analytically. The singularity of stresses near the crack tip is discussed and the dynamic stress intensity factors are presented. Finally the solution of dynamic debonding under x*-type loads is obtained by using the superposition method.
引用
收藏
页码:283 / 295
页数:13
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