A fabrication process for silicon microstrip detectors with integrated front-end electronics

被引:19
作者
Dalla Betta, GF [1 ]
Boscardin, M
Gregori, P
Zorzi, N
Pignatel, GU
Batignani, G
Giorgi, M
Bosisio, L
Ratti, L
Speziali, V
Re, V
机构
[1] IRST, ITC, I-38050 Trento, Italy
[2] Univ Trent, Dipartimento Ingn Mat, I-38050 Trento, Italy
[3] Univ Pisa, Dipartimento Fis, I-56010 San Piero A Grado, PI, Italy
[4] Ist Nazl Fis Nucl, I-56010 San Piero A Grado, PI, Italy
[5] Univ Trieste, Dipartimento Fis, I-34128 Trieste, Italy
[6] Ist Nazl Fis Nucl, I-34128 Trieste, Italy
[7] Univ Bergamo, I-24044 Dalmine, BG, Italy
[8] Ist Nazl Fis Nucl, I-24044 Dalmine, BG, Italy
[9] Univ Pavia, Dipartimento Elettron, I-27100 Pavia, Italy
[10] Ist Nazl Fis Nucl, I-27100 Pavia, Italy
关键词
fabrication technology; integrated electronics; microstrip detectors;
D O I
10.1109/TNS.2002.1039608
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report on an research and development activity aimed at the fabrication of silicon microstrip detectors with integrated front-end electronics to be used in high-energy physics and space experiments and medical/industrial imaging applications. A specially tailored fabrication technology has been developed at ITC-IRST (Trento, Italy), which allows for the production of single-sided microstrip detectors, with integrated coupling capacitors and polysilicon resistors, as well as active devices, including N-channel junction field effect transistors and N- or P-channel MOS transistors. The main characteristics of the fabrication process are outlined. Experimental results from the electrical characterization of the devices are reported, showing that transistors with good electrical figures can be obtained within the proposed technology while preserving the basic detector parameters.
引用
收藏
页码:1022 / 1026
页数:5
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