Grain boundary migration and grooving in thin 3-D systems

被引:18
作者
Derkach, Vadim [1 ]
Novick-Cohen, Amy [1 ]
Vilenkin, Arkady [2 ]
Rabkin, Eugen [3 ]
机构
[1] Technion Israel Inst Technol, Dept Math, IL-32000 Haifa, Israel
[2] Hebrew Univ Jerusalem, Racah Inst Phys, IL-91904 Jerusalem, Israel
[3] Technion Israel Inst Technol, Dept Mat Sci & Engn, IL-32000 Haifa, Israel
基金
以色列科学基金会;
关键词
Finite-difference modeling; Microstructure; Surface diffusion; Grain growth; Nanocrystalline films; COUPLED SURFACE; CAPILLARY INSTABILITIES; FILMS; MOTION; MECHANISM; MODEL; AU;
D O I
10.1016/j.actamat.2013.10.061
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We employ numerical simulations and experimental methods to study grain boundary migration in idealized 3-D systems of three grains in a thin film, focusing on hole formation and annihilation of small grains. The initial structure is taken to be columnar, and isotropy is assumed for simplicity. The grain boundaries and the external surfaces of the three-grain system are assumed to be governed by mean curvature motion and surface diffusion, respectively. Along the thermal grooves, where the grain boundaries and the exterior surfaces couple, balance of mechanical forces, continuity of the surface chemical potential, and balance of mass flux dictate the boundary conditions. Using a parametric description for the evolving surfaces yields partial differential algebraic equations which are solved with finite-difference schemes on staggered grids. The evolution of the three-grain system results in hole formation or annihilation of the smallest grain, depending on the relative size of the smallest grain. Shortly prior to annihilation, the exterior surface of the smallest grains may invert, partially losing its convexity, with annihilation being accompanied by accelerated pitting rates. Similar features were observed (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:194 / 206
页数:13
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