Thermal testing methods to increase system reliability

被引：9

作者：

Szekely, V

Rencz, M

Courtois, B

机构：

来源：

THIRTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 1997 | 1997年

关键词：

thermal testing; thermal design; electrothermal simulation; CMOS temperature sensor; design for thermal testability (DfTT); thermal transient testing; thermal characterization;

D O I：

10.1109/STHERM.1997.566798

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Scaling down of ICs and the increased packaging densities resulted in increased concern about thermal issues during the design of ICs and their packages. In this paper newly developed design and testing methods ale presented. The SISSSI electro-thermal simulator pl edicts the layout dependent electro-thermal behaviour of circuits. The presented CMOS temperature sensors and the idea of DfTT designs assure on-line temperature monitoring of circuits and packages. The also presented thermal transient testing method enables accurate thermal characterization of packages both for design and verification purposes. The capabilities of the new tools are demonstrated with application examples.

引用

页码：210 / 217

页数：8