The role of grain boundary plane orientation on intergranular corrosion of symmetric and asymmetric [110] tilt grain boundaries in directionally solidified pure copper

被引：31

作者：

Miyamoto, H ^{[1
]}

Ikeuchi, K ^{[1
]}

Mimaki, T ^{[1
]}

机构：

[1] Doshisha Univ, Dept Mech Engn, Kyoto 6100394, Japan

来源：

SCRIPTA MATERIALIA | 2004年 / 50卷 / 12期

关键词：

Bridgman techniques; copper; corrosion; coincidence lattice; grain boundary structure;

D O I：

10.1016/j.scriptamat.2004.03.016

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Susceptibility to intergranular corrosion of asymmetric grain boundaries in pure copper was well correlated with a geometric criteria, i.e. the effective interplanar spacing of grain boundaries rather than coincidence site lattice (CSL) scheme if we rationally assume that the grain boundary structure relaxes to be formed by low-index planes, therefore resulting in high interplanar spacing. (C) 2004 Published by Elsevier Ltd. on behalf of Acta Materialia Inc.

引用

页码：1417 / 1421

页数：5

共 20 条

[1]

ARORA OP, 1966, T METALL SOC AIME, V236, P1205

[2]

BOOS JY, 1972, LOCALIZED CORROSION, V3, P556

[3] STRUCTURE OF HIGH-ANGLE GRAIN BOUNDARIES [J].