Nuclear contribution into single-event upset in 3D on-board electronics at moderate energy cosmic proton impact

被引：0

作者：

Chechenin, N. G. ^{[1
]}

Chuvilskaya, T. V. ^{[1
]}

Shirokova, A. A. ^{[1
]}

机构：

[1] Moscow MV Lomonosov State Univ, Skobeltsyn Inst Nucl Phys, Moscow 119991, Russia

来源：

12TH INTERNATIONAL CONFERENCE ON NUCLEUS-NUCLEUS COLLISIONS 2015 | 2016年 / 117卷

关键词：

RAY PROTONS;

D O I：

10.1051/epjconf/201611705006

中图分类号：

TL [原子能技术]; O571 [原子核物理学];

学科分类号：

0827 ; 082701 ;

摘要：

In continuation and development of our previous works where nuclear reactions of moderate energy (10 - 400 MeV) protons with Si, Al and W have been investigated, the results of reactions with Cu are reported in this paper. Cu is a most important component in composition of materials in contact pads and pathways of modern and perspective ultra large-scale integration circuitry, especially in 3D topology.

引用

页数：6

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