A cofireable dielectric on stainless steel thick film material system for automotive applications

被引：0

作者：

Levitsky, ME ^{[1
]}

Flick, S ^{[1
]}

Malanga, D ^{[1
]}

机构：

[1] Heraeus Inc, Cermalloy Div, W Conshohocken, PA 19428 USA

来源：

1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1999年 / 3906卷

关键词：

stainless steel; dielectric; DOS; cofireable; automotive; insulation and keying;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Historically alumina substrates have been used for manufacturing and assembly of thick film hybrids. Alumina substrates used for thick film hybrid circuits are not strong mechanically, especially as substrate size increases, and are prone to shattering upon rapid heating and cooling processes. This issue directly influences yield losses due to breaking during all phases of processing and assembly for the hybrid on alumina. Recent technological development and availability of insulating dielectric compositions that can be processed with stainless steel have drastically increased the mechanical strength and integrity of the hybrid circuit. This paper reviews two insulative systems and processes, sequential (old technology) and cofired (new technology) on 430 stainless steel successfully used today. In addition, we will discuss in detail the benefits, performance characteristics, advantages and disadvantages of sequentially fired and cofired processing of thick film pastes on stainless steel. The use of this technology will move hybrid circuit manufacturing forward to new application and performance levels within, but not limited to, the automotive industry.

引用

页码：112 / 117

页数：6