Multifunctional Logic-in-Memory Cell Based on Wafer-Scale MoS2 Thin Films Prepared by Atomic Layer Deposition

被引:0
|
作者
Zhang, Tianbao [1 ]
Cao, Yuanyuan [1 ]
Gu, Zhenghao [1 ]
Zhu, Hao [1 ,2 ]
Chen, Lin [1 ,2 ]
Sun, Qingqing [1 ,2 ]
Zhang, David Wei [1 ,2 ]
机构
[1] Fudan Univ, State Key Lab ASIC & Syst, Sch Microelect, 220 Handan Rd, Shanghai 200433, Peoples R China
[2] Zhangjiang Fudan Int Innovat Ctr, Shanghai 201203, Peoples R China
来源
PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS | 2022年 / 16卷 / 06期
关键词
arrays; atom layer deposition; floating gate; logic in memory; MoS2;
D O I
10.1002/pssr.202200031
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Large-volume data storage and high-efficiency data processing have been greatly urged by the fast development in artificial intelligence and internet of things involving novel semiconductor materials. Logic-in-memory has provided a promising route to address the processing/storage bottleneck in advanced computing systems. Herein, a logic-in-memory design based on wafer-scale MoS2 floating-gate field-effect transistor (FGFET) arrays is demonstrated. Multiple logic states and over 10 V memory window are achieved through electrical gate modulation, which further enables in-memory computing including logic functions of inverter and two-input NAND gates. Such robust and stable logic-in-memory is ascribed to the highly uniform wafer-scale MoS2 thin film prepared by atomic layer deposition (ALD)-based synthesis and the reproducible electrical performance of the device arrays. As both memory and computing units are based on floating-gate FET architecture with area efficiency, the proposed logic-in-memory cell can accomplish multifunctional tasks with fewer transistors, suggesting a potential application in high-density and complex information processing and data storage systems.
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页数:6
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