Preparation of spherical ceria coated silica nanoparticle abrasives for CMP application

被引:44
作者
Peedikakkandy, Lekha [1 ]
Kalita, Laksheswar [2 ]
Kavle, Pravin [1 ]
Kadam, Ankur [2 ]
Gujar, Vikas [2 ]
Arcot, Mahesh [2 ]
Bhargava, Parag [1 ]
机构
[1] Indian Inst Technol, Dept Met Engn & Mat Sci, Mumbai 400076, Maharashtra, India
[2] Indian Inst Technol, Dept Elect Engn, Adv Technol Grp, Appl Mat India Pvt Ltd, Mumbai 400076, Maharashtra, India
关键词
Chemical mechanical planarization; Ceria; Silica; Nanoparticles; CHEMICAL-MECHANICAL PLANARIZATION; PARTICLES; SLURRY; SIZE;
D O I
10.1016/j.apsusc.2015.09.149
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper describes synthesis of spherical and highly mono-dispersed ceria coated silica nanoparticles of size similar to 70-80 nm for application as abrasive particles in Chemical Mechanical Planarization (CMP) process. Core silica nanoparticles were initially synthesized using micro-emulsion method. Ceria coating on these ultrafine and spherical silica nanoparticles was achieved using controlled chemical precipitation method. Study of various parameters influencing the formation of ceria coated silica nanoparticles of size less than 100 nm has been undertaken and reported. Ceria coating over silica nanoparticles was varied by controlling the reaction temperature, pH and precursor concentrations. Characterization studies using X-ray diffraction, scanning electron microscopy, transmission electron microscopy and Energy Dispersive X-ray analysis show formation of crystalline CeO2 coating of 10 nm thickness over silica with spherical morphology and particle size <100 nm. Aqueous slurry of ceria coated silica abrasive was prepared and employed for polishing of oxide and nitride films on silicon substrates. Polished films were studied using ellipsometry and an improvement in SiO2:SiN selective removal rates up to 12 was observed using 1 wt% ceria coated silica nanoparticles slurry. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:1306 / 1312
页数:7
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