The solid-liquid interfacial energy for solid Zn solution at the eutectic Zn-Sn-Mg ternary alloy

被引:4
作者
Billur, Canan Alper [1 ]
Saatci, Buket [1 ]
机构
[1] Erciyes Univ, Dept Phys, TR-38039 Kayseri, Turkey
关键词
Zn-Sn-Mg ternary alloy; Gibbs-Thomson coefficient; Interfacial energy; LEAD-FREE SOLDER; AL-CU; SYSTEM; PHASE; BI; AG; EQUILIBRIUM; BISMUTH; PB;
D O I
10.1016/j.tca.2014.05.010
中图分类号
O414.1 [热力学];
学科分类号
摘要
The Gibbs-Thomson coefficient, Gamma, the effective entropy change, Delta S-f, the solid-liquid interfacial energy, sigma(SL), and the grain boundary energy, sigma(GB), for solid Zn solution at the eutectic Zn-Sn-Mg ternary alloy have been calculated using the grain boundary groove method with Bridgman-type directional solidification apparatus. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:85 / 89
页数:5
相关论文
共 41 条
[1]   Effect of bismuth and silver on the corrosion behavior of Sn-9Zn alloy in NaCl 3 wt.% solution [J].
Ahmido, A. ;
Sabbar, A. ;
Zouihri, H. ;
Dakhsi, K. ;
Guedira, F. ;
Serghini-Idrissi, M. ;
El Hajjaji, S. .
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2011, 176 (13) :1032-1036
[2]   Determination of thermal conductivity and interfacial energy of solid Zn solution in the Zn-Al-Bi eutectic system [J].
Aksoz, Sezen ;
Ocak, Yavuz ;
Marasli, Necmettin ;
Keslioglu, Kazim .
EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2011, 35 (02) :395-404
[3]  
[Anonymous], SOLID LIQUID INTERFA
[4]   Novel experimental technique to observe equilibrated grain boundary groove shapes in opaque alloys [J].
Boeyuek, U. ;
Engin, S. ;
Marasli, N. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 476 (1-2) :213-219
[5]   Determination of the solid-liquid interface energy in the Al-Cu-Ag system [J].
Bulla, A. ;
Carreno-Bodensiek, C. ;
Pustal, B. ;
Berger, R. ;
Buehrig-Polaczek, A. ;
Ludwig, A. .
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2007, 38A (09) :1956-1964
[6]   Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2 wt.% Cu alloy [J].
Cadirli, E. ;
Boyuk, U. ;
Engin, S. ;
Kaya, H. ;
Marasli, N. ;
Ulgen, A. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 486 (1-2) :199-206
[7]   Influence of minor Bi additions on the interfacial morphology between Sn-Zn-xBi solders and a Cu layer [J].
Chen, Jie ;
Shen, Jun ;
Min, Dong ;
Peng, Changfei .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2009, 20 (11) :1112-1117
[8]  
Christian J.W., 1975, The Theory of Transformations in Metals and Alloys: An Advanced Textbook in Physical Metallurgy, V2nd
[9]   Determination of interfacial energies in the Al-Ag and Sn-Ag alloys by using Bridgman type solidification apparatus [J].
Engin, S. ;
Boyuk, U. ;
Marasli, N. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 488 (01) :138-143
[10]   Solid-liquid interfacial energy of bismuth in the Bi-Cd eutectic system [J].
Erol, M ;
Marasli, N ;
Keslioglu, K ;
Gündüz, M .
SCRIPTA MATERIALIA, 2004, 51 (02) :131-136