Evaluation of thermal expansion coefficient of twinned YBa2Cu3O7-δ film for prediction of crack formation on various substrates

被引：13

作者：

Yamada, Y ^{[1
]}

Kawashima, J ^{[1
]}

Wen, JG ^{[1
]}

Niiori, Y ^{[1
]}

Hirabayashi, I ^{[1
]}

机构：

[1] ISTEC, Superconduct Res Lab, Atsuta Ku, Nagoya, Aichi 4568687, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2000年 / 39卷 / 3A期

关键词：

oxide superconductor; thin film; crack formation; thermal expansion; liquid phase epitaxy;

D O I：

10.1143/JJAP.39.1111

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The effective thermal expansion coefficient of the c-axis-oriented, twinned YBa2Cu3O7-delta (YBCO) film formed on SrTiO3 (STO) substrates by liquid phase epitaxy was evaluated by observing crack formation of the films. The critical thickness of the YBCO film grown on STO at 920 degrees C is about 1.35 mu m. A simple fracture model with mechanical properties of materials yields the effective thermal expansion coefficient of YBCO film of about 14.0 x 10(-6)/K, as an engineering value for prediction of crack formation on various substrates. Temperature dependence in the thermal expansion of the substrate and the film suggests that control of oxygenation conditions enables us to suppress maximum stress induced in the films. According to the estimation, we predict the critical film thickness on various substrates used widely in oxide superconductor research.

引用

页码：1111 / 1115

页数：5

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