共 15 条
[2]
Huang HJ, 2018, 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), P491, DOI 10.1109/ICEPT.2018.8480671
[4]
ISHIKAWA D, 2018, 2018 7 EL SYST INT T, P1
[5]
The bonding properties of various surface finishes with Cu paste for pressure sintering
[J].
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020),
2020,
:749-754
[6]
Sintering of Copper Particles for Die Attach
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,
2012, 2 (10)
:1587-1591
[7]
Low-Temperature and Low-Pressure Cu-Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
[J].
NANOSCALE RESEARCH LETTERS,
2017, 12