High speed Tilted white-light Scanning Interferometry system for package bumps inspection

被引：0
|
作者：
Bhang, Jehhoon [1 ]
Lee, Seoungrag [1 ]
Chang, Kyoungseop [1 ]
Roh, Youngjun [1 ]
机构：
[1] LG Elect, Prod Engn Res Inst, Pyeongtaek, South Korea
来源：
2012 INTERNATIONAL SYMPOSIUM ON OPTOMECHATRONIC TECHNOLOGIES (ISOT) | 2012年
关键词：
Tilted white-light Scanning Interferometry (TSI); package bumps; high speed camera; parallel processing;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Tilted white-light Scanning Interferometry(TSI) is oriented from Vertical Scanning white-light interferometry(VSI). TSI is optimized for lateral scanning; it's possible that scanning object with only one axis movement while VSI have to move more than two axis to scan a object lager than its Field Of View(FOV). This paper introduces implemented system for package bumps scanning using TSI with our own developed high speed camera.
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页数：4
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