Electrostatic bonding of a silicon master to a glass wafer for plastic microchannel fabrication

被引：8
作者：
Liu, Jun-Shan [1 ]
Liu, Chong [1 ]
Guo, Ji-Hong [1 ]
Wang, Li-Ding [1 ]
机构：
[1] Dalian Univ Technol, Key Lab Micronanotechnol & Syst Liao Ning Prov, Dalian 116023, Liaoning, Peoples R China
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2006年 / 178卷 / 1-3期
基金：
中国国家自然科学基金;
关键词：
microchannel; microfluidics; hot embossing; plastic; polymethylmethacrylate (PMMA); CAPILLARY ELECTROPHORESIS; MICROFLUIDIC SYSTEMS; CHIP; DNA; SEPARATION; AMPLIFICATION; DETECTOR; DEVICE;
D O I：
10.1016/j.jmatprotec.2006.04.009
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Fabrication of microchannels on polymethylmethacrylate (PNMA) substrates using novel microfabrication methods is demonstrated. The image of microchannels is transferred from a silicon master possessing the inverse image of the microchannel to a PMMA plate by using hot embossing methods. The silicon master is electrostatically bonded to a Pyrex7740 glass wafer, which improves the device yield from similar to 20 devices to hundreds of devices per master. Effects of embossing temperature, pressure and time on the accuracy of replication are systematically studied. According to the suggested experimental model, the time for the whole embossing procedure is shortened from about 20 to 6 min, and the accuracy of replication is 99.3%. The reproducibility of the hot embossing method is evaluated using 10 channels on different microfluidic devices, with variations of 1.4% in depth and 1.8% in width. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码：278 / 282
页数：5
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