Novel crosslinking of high-order and multiple copper twins in advanced microelectronics packaging

被引：3

作者：

Zhang, W ^{[1
]}

Liu, CZ ^{[1
]}

Li, DX ^{[1
]}

Sui, ML ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China

来源：

ADVANCED ENGINEERING MATERIALS | 2004年 / 6卷 / 04期

关键词：

D O I：

10.1002/adem.200300540

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Novel crosslinking of high-order and multiple copper twins has been formed in the metallization/solder interconnect subjected to the thermal aging. This surprising finding may illustrate a universal metallization failure mode. Meanwhile, many copper nanocrystals in situ originated from those twins crosslinking shed a novel light on the synthesis approach to fascinating nanocrystalline metals.

引用

页码：232 / 234

页数：3

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