Investigation of Electrical Discontinuity in Flip-chip Package

被引：0

作者：

Xu, Yanbo ^{[1
]}

Yang, Xiaoli ^{[2
]}

Li, Yan ^{[1
]}

Zuo, Panpan ^{[1
]}

Zheng, Hongxing ^{[1
]}

Li, Erping ^{[1
]}

机构：

[1] Hebei Univ Technol, Sch Elect & Informat Engn, Tianjin, Peoples R China

[2] Zhejiang Univ, Coll Informat Sci & Elect Engn, Hangzhou, Zhejiang, Peoples R China

来源：

2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2017年

基金：

中国国家自然科学基金;

关键词：

flip-chip; discontinuity; equivalent circuit;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the discontinuity of a flip-chip (FC) transition between a microstrip line (MS) and a coplanar waveguide (CPW) is modeled and analyzed. The test device is fabricated and measured in comparison with both full-wave and equivalent circuit simulation. The circuit includes more elements and is more complex than other types of transitions. The S parameters of the circuit model have been verified with that of the full -wave simulation, which matches well so that greatly simplifies the design of the complex packages.

引用

页数：3

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