Effects of Recrystallization Annealing Process on Development of Cube Textured of Ni-5at%W Alloy Substrate

A Ni-5at%W ingot was prepared by a combination process of PM and remelting. Afterwards the ingot was swaged and drawn into wires which were finally cold-rolled into trips with 70 gin thickness. A recrystallization annealing for the substrate trip was carried out at different temperatures (800 similar to 1300 degrees C) for different time (0-3 h). Cube texture in the substrate was evaluated by means of X-ray diffraction and electron back-scatter diffraction, meanwhile, the hardness of the substrqpe was characterized. It was found that the recrystallization process was almost completed below 800 degrees C and the fraction of cube texture did not obviously change upon annealing time prolonging for 1 similar to 3 h at 980 degrees C. Strong cube texture was obtained after annealing at 1100 degrees C and 1300 degrees C, and the surface area fraction of the grains orientated within 8 degrees around ideal {001}< 100 > texture were about 93% and 99.8% of the total grains, respectively. After the substrate trip was annealed at and below 1300 degrees C, its microstructure was uniform, no abnormal grain growth was found, and the cube texture exhibited good stability at high temperature. However, abnormal grain growth and other texture components appeared in the substrate trip after annealed at 1400 degrees C.