Development of lead (Pb)-free interconnection materials for microelectronics

被引:14
作者
Kang, SK [1 ]
机构
[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Heights, NY 10598 USA
来源
METALS AND MATERIALS-KOREA | 1999年 / 5卷 / 06期
关键词
Pb-free solders; electrically conducting adhesives; electronic packaging;
D O I
10.1007/BF03026302
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Although the amount of Pb or Pb-containing solders used in microelectronics counts only a small fraction of the total Pb usage. the demand for manufacturing "green" products has promoted active research and development for the Pb-free interconnection materials in the recent years. As a result, several candidate materials are now available in two categories: Pb-free solders and electrically conducting adhesives. Ln this paper, the new development activities of both materials are briefly reviewed in terms of their promising properties, applications, and concerns.
引用
收藏
页码:545 / 549
页数:5
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