Exothermic low temperature sintering of Cu nanoparticles

被引：29

作者：

Mittal, Jagjiwan ^{[1
]}

Lin, Kwang-Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

来源：

MATERIALS CHARACTERIZATION | 2015年 / 109卷

关键词：

Cu nanoparticles; Differential scanning calorimetry; Sintering; X-ray diffraction; Surface energy; In situ transmission electron microscopy; COPPER NANOPARTICLES; SOLDER ALLOY; JET; MICROSTRUCTURE; BEHAVIOR; GROWTH; FILMS;

D O I：

10.1016/j.matchar.2015.09.009

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Sintering of the Cu nanopartide at low temperatures resulted in exothermic behavior after its initiation. The calorimetry study of the heating of a 20 nm copper nanoparticles agglomerate revealed the evolution of 41.17 J/g of heat between 170 degrees C and 270 degrees C. High resolution transmission electron microscopy (HRTEM) images indicated that the heat generation was accompanied by sintering. The surface energy of the 20 nm copper nanopartides was estimated to be 1.23 x 10(3) erg/cm(2) based on the heat released during sintering. The in situ high resolution transmission electron microscope (HRTEM) investigation showed that vigorous sintering occurred between 217 and 234 degrees C, which took place through the dislocation sintering mechanism. (C) 2015 Elsevier Inc. All rights reserved.

引用

页码：19 / 24

页数：6

共 26 条

[1]

ALLEN BC, 1963, T METALL SOC AIME, V227, P1175

[2] High density of electrodeposited Sn/Ag bumps for flip chip connection [J].

Bigas, M ;

Cabruja, E .

MICROELECTRONIC ENGINEERING, 2006, 83 (03) :399-403

[3] Sintering of copper nanopowers under hydrogen: an in situ X-ray diffraction analysis [J].

Champion, Y ;

Bernard, F ;

Guigue-Millot, N ;

Perriat, P .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 360 (1-2) :258-263

[4] Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate [J].

Choi, WK ;

Lee, HM .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) :1207-1213

[5]

Gaskell D.R., 2008, INTRO THERMODYNAMICS, P584

[6] In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics [J].

Hwang, Hyun-Jun ;

Chung, Wan-Ho ;

Kim, Hak-Sung .

NANOTECHNOLOGY, 2012, 23 (48)

[7] In-situ TEM studies of the sintering behavior of copper nanoparticles covered by biopolymer nanoskin [J].

Ida, Kiyonobu ;

Sugiyama, Yasuyuki ;

Chujyo, Yuki ;

Tomonari, Masanori ;

Tokunaga, Tomoharu ;

Sasaki, Katsuhiro ;

Kuroda, Kotaro .

JOURNAL OF ELECTRON MICROSCOPY, 2010, 59 :S75-S80

[8] Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing [J].

Jeong, Sunho ;

Woo, Kyoohee ;

Kim, Dongjo ;

Lim, Soonkwon ;

Kim, Jang Sub ;

Shin, Hyunjung ;

Xia, Younan ;

Moon, Jooho .

ADVANCED FUNCTIONAL MATERIALS, 2008, 18 (05) :679-686

[9] Synthesis and characterization of copper nanoparticles [J].

Khanna, P. K. ;

Gaikwad, S. ;

Adhyapak, Rv ;

Singh, N. ;

Marimuthu, R. .

MATERIALS LETTERS, 2007, 61 (25) :4711-4714

[10] Highly conductive ink jet printed films of nanosilver particles for printable electronics [J].

Kim, D ;

Moon, J .

ELECTROCHEMICAL AND SOLID STATE LETTERS, 2005, 8 (11) :J30-J33

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