Advances on doping strategies for triple-gate finFETs and lateral gate-all-around nanowire FETs and their impact on device performance

被引:25
作者
Veloso, A. [1 ]
De Keersgieter, A. [1 ]
Matagne, P. [1 ]
Horiguchi, N. [1 ]
Collaert, N. [1 ]
机构
[1] Imec, Kapeldreef 75, B-3001 Leuven, Belgium
关键词
Triple-gate finFETs; Gate-all-around nanowire FETs; Doping; Inversion-mode device; Junctionless transistors; CHARACTERISTIC VARIABILITY; SILICON; INTEGRATION; RETENTION; EXTENSION; BEHAVIOR;
D O I
10.1016/j.mssp.2016.10.018
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews some of the key doping strategies pursued for scaled finFET devices fabrication, addressing several of the critical integration challenges faced by this device architecture with regard to junction engineering, parasitics and series resistance control and their impact on device performance, reliability and variability. We will therefore look into the extendibility possibilities of using conventional doping techniques such as ion implantation, explore the use of novel methods to enable conformal doping of the thin body of the devices, and also evaluate junctionless vs. inversion-mode type of transistors for gate-all-around nanowire FETs, which can essentially be considered as the ultimate scaling limit of triple-gate finFETs.
引用
收藏
页码:2 / 12
页数:11
相关论文
共 82 条
[1]  
[Anonymous], 2011 S VLSI TECHN VL
[2]  
[Anonymous], IEEE S VLSI TECHN
[3]  
[Anonymous], IEDM
[4]   Junction Field Effect on the Retention Time for One-Transistor Floating-Body RAM [J].
Aoulaiche, Marc ;
Nicoletti, Talitha ;
Almeida, Luciano Mendes ;
Simoen, Eddy ;
Veloso, Anabela ;
Blomme, Pieter ;
Groeseneken, Guido ;
Jurczak, Malgorzata .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (08) :2167-2172
[5]  
Auth C., 2012, 2012 IEEE Symposium on VLSI Technology, P131, DOI 10.1109/VLSIT.2012.6242496
[6]  
Ban I., 2008, IEEE S VLSI TECHN, P92
[7]  
Bangsaruntip S, 2009, INT EL DEVICES MEET, P272
[8]  
Bangsaruntip S., 2013, Electron Devices Meeting (IEDM), 2013 IEEE International, P20, DOI DOI 10.1109/IEDM.2013.6724667
[9]  
Bangsaruntip S., 2010, ELECT DEV LETT, V31, P903
[10]   ELECTRICAL BEHAVIOR OF GROUP-3 AND GROUP-V IMPLANTED DOPANTS IN SILICON [J].
BARON, R ;
SHIFRIN, GA ;
MARSH, OJ ;
MAYER, JW .
JOURNAL OF APPLIED PHYSICS, 1969, 40 (09) :3702-&