High-speed energy efficient selective removal of large area copper layer by laser induced delamination

被引：5
|
作者：
Kmetec, Blaz [1 ]
Kovacic, Drago [1 ]
Mozina, Janez [2 ]
Podobnik, Bostjan [1 ]
机构：
[1] LPKF Laser & Elekt DOO, SI-4202 Naklo, Slovenia
[2] Univ Ljubljana, Fac Mech Engn, SI-1000 Ljubljana, Slovenia
来源：
APPLIED SURFACE SCIENCE | 2009年 / 255卷 / 20期
关键词：
Laser rubout; Modelling: laser-matter interaction; Laser delamination; Optimization: process time; PRINTED-CIRCUIT BOARDS; TEMPERATURE; COMPOSITES; SIMULATION; ADHESION;
D O I：
10.1016/j.apsusc.2009.06.032
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
An indirect laser-induced method for selective removal of large copper areas from a printed circuit board is theoretically and experimentally investigated. The results show that the threshold condition for the process involves phase transition of the epoxy-based substrate resin. Optimal parameters for maximizing process speed are found and discussed. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码：8598 / 8602
页数：5
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