Multiscale modelling of multilayer substrates

被引:9
|
作者
Ubachs, R. L. J. M. [1 ]
van der Sluis, O.
van Driel, W. D.
Zhang, G. Q.
机构
[1] Delft Univ Technol, Dept Precis & Microsyst Engn, Delft, Netherlands
[2] Philips Appl Technol, NL-5656 AE Eindhoven, Netherlands
[3] Philips Semicond, IMO BE Innovat BY, NL-6534 AE Nijmegen, Netherlands
关键词
D O I
10.1016/j.microrel.2006.07.013
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A multiscale (global-local) numerical method for the assessment of reliabilty issues in substrates is presented. The method allows for the calculation of accurate local quantities, without the need for heavy calculations. A global step is performed by first subdividing the substrate into cells. Next, the structure (circuit) of each cell is analysed and quantified and, based on the result, appropriate effective properties are assigned. In this way a homogenised finite element model of the substrate is constructed which is used to determine its global response. A local step is subsequently performed, where only a small 'region of interest' of the substrate is modelled in detail. The loading is accomplished by describing boundary conditions extracted from the global simulation.
引用
收藏
页码:1472 / 1477
页数:6
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