Interface characterization of nickel contacts to bulk bismuth tellurium selenide

被引：46

作者：

Iyore, O. D. ^{[1
]}

Lee, T. H. ^{[1
]}

Gupta, R. P. ^{[1
]}

White, J. B. ^{[2
]}

Alshareef, H. N. ^{[1
]}

Kim, M. J. ^{[1
]}

Gnade, B. E. ^{[1
]}

机构：

[1] Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA

[2] Marlow Ind, Dallas, TX 75238 USA

来源：

SURFACE AND INTERFACE ANALYSIS | 2009年 / 41卷 / 05期

关键词：

electron energy loss spectroscopy; focused ion beam; transmission electron microscopy; thermoelectric materials; x-ray diffraction; FOCUSED ION-BEAM; FILMS;

D O I：

10.1002/sia.3046

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Transmission electron microscopy (TEM) characterization of nickel contacts to bulk bismuth tellurium selenide [Bi-2(Te,Se)(3)] is reported. Samples were prepared in a dual column focused ion beam/scanning electron microscope (FIB/SEM) system using a lift-out technique, with ion beam energy and exposure times carefully optimized to minimize sample damage. Diffusion of Ni into Bi-2(Te,Se)(3) was observed and the formation of a nickel telluride (NiTe) interfacial region confirmed after heat treatment at 200 degrees C. Selected area diffraction patterns provided evidence of a modified bismuth telluride-like structure at the interface, identified by analytical electron microscopy to be composed of Ni and Bi-2(Te,Se)(3). Copyright (C) 2009 John Wiley & Sons, Ltd.

引用

页码：440 / 444

页数：5

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