Novel morphology and solidification behavior of eutectic bismuth-tin (Bi-Sn) nanowires

被引:12
作者
Chen, Shih Hsun [2 ]
Chen, Chien Chon [1 ]
Chao, Chuen Guang [2 ]
机构
[1] Natl United Univ, Dept Energy & Resources, Miaoli 36003, Taiwan
[2] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30050, Taiwan
关键词
Bi-Sn nanowires; Eutectic; AAO; Stoichiometry; Solidification; FABRICATION; MICROSTRUCTURE; SOLDER; GOLD;
D O I
10.1016/j.jallcom.2009.03.107
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In the present work we show a simple and robust fabrication process for dense and continuous bismuth-tin (Bi-Sn) eutectic nanowires. The Bi-Sn eutectic nanowires of 200 nm diameter and several tens of mu m, in length were fabricated by a vacuum hydraulic force method. The alloy melt was injected into an anodic aluminum oxide (AAO) template to form nanowires after melt solidification. For this process, nanowires were formed from non-atomic deposition with liquid alloy; in this way, the composition of nanowires can be controlled precisely in stoichiometry. The Bi-Sn melt was restricted inside the AAO which has a low thermo-conduction and long period cooling rate around the melt. On the other hand, the heat flow is along the tube Z-axis and the melt is solidified from the AAO bottom to top because of the open pore on the AAO top. The eutectic nanowires were found to be dense and continuous with a uniform diameter throughout the length of the wires and with a lamellar microstructure along the wires' Z-axis. In addition, the alternative segmental compositions showed that the ratio of tin to bismuth is approximately 33:1. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:270 / 273
页数:4
相关论文
共 41 条
[31]   Solidification Behavior and Mechanical Properties of Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi Solder Alloys, and Microstructures in Joints Formed Using Them [J].
Lee, Hye-Min ;
Moon, Jung Tak ;
Lee, Young -Woo ;
Kim, Hui Joong ;
Lee, Seul Gi ;
Lee, Joug-Hyun .
KOREAN JOURNAL OF METALS AND MATERIALS, 2024, 62 (07) :511-523
[32]   Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn-Bi by grain boundary diffusion with the grain growth at solid-state temperatures [J].
Minho, O. ;
Tanaka, Yuki ;
Kobayashi, Equo .
INTERMETALLICS, 2023, 161
[33]   Effect of melt superheating treatment on solidification behavior of uniform Al10Bi54Sn36 monotectic alloy [J].
Wang, Lin ;
Bo, Lin ;
Zuo, Min ;
Zhao, Degang .
JOURNAL OF MOLECULAR LIQUIDS, 2018, 272 :885-891
[34]   Novel insight into dry sliding behavior of Cu-Pb-Sn in-situ composite with secondary phase in different morphology [J].
Dong, B. W. ;
Wang, S. H. ;
Dong, Z. Z. ;
Jie, J. C. ;
Wang, T. M. ;
Li, T. J. .
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 40 :158-167
[35]   Solidification behavior of nanoscaled tri-phasic bismuth-indium-tin alloy particles embedded in Al-Cu-Fe quasicrystalline matrix [J].
Tiwari, Khushubo ;
Paliwal, Manas ;
Verma, Miral ;
Biswas, Krishanu .
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 867
[36]   Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder [J].
Gain, Asit Kumar ;
Zhang, Liangchi .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (01) :781-794
[37]   Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58Bi/Cu Solder Interconnect During Reflow Soldering Process [J].
Ma, Wen-Jing ;
Ke, Chang-Bo ;
Zhou, Min-Bo ;
Zhang, Xin-Ping .
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, :330-333
[38]   Constitutive behavior and Anand model of novel lead-free solder Sn-Zn-Bi-In-P [J].
Liu, Jian-Chun ;
Yu, Hong-Jiao ;
Zhang, Gong ;
Wang, Zheng-Hong ;
Ma, Ju-Sheng .
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, :156-161
[39]   Optimizing the Morphology and Solidification Behavior of Fe-Rich Phases in Eutectic Al-Si-Based Alloys with Different Fe Contents by Adding Mn Elements [J].
Luo, Lei ;
Tang, Yingchun ;
Liang, Xiao ;
Su, Yanqing ;
Zhang, Youwei ;
Xie, Huasheng .
MATERIALS, 2024, 17 (16)
[40]   Reliability performance of tin-bismuth-silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs [J].
Sun, Huayu ;
Chan, Y. C. ;
Wu, Fengshun .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 29 (10) :8584-8593