Heat transfer performance of graphene nano-platelets laden micro-encapsulated PCM with polymer shell for thermal energy storage based heat sink

被引:109
作者
Praveen, B. [1 ]
Suresh, S. [1 ]
Pethurajan, Vignesh [1 ]
机构
[1] Natl Inst Technol, Dept Mech Engn, Nanotechnol Res Lab, Tiruchirappalli 620015, Tamil Nadu, India
关键词
Micro-encapsulated PCM; Graphene nano-platelets; TES based heat sink; Temperature rise rate; Thermal conductance; PHASE-CHANGE MATERIAL; MICROENCAPSULATION; CONDUCTIVITY;
D O I
10.1016/j.applthermaleng.2019.04.072
中图分类号
O414.1 [热力学];
学科分类号
摘要
Encapsulation of phase change material (PCM) prevents from leakage and can evade the adverse effect of bulk volume expansion. In this study, experimental results on the heat transfer performance of graphene nano-platelets laden microencapsulated PCM (ME/GnP PCM) in a finned thermal energy storage based heat sink are presented. In-situ polymerization method was used to prepare the capsules with paraffin/polyurethane as core/ shell material. The samples were characterized by its morphology, capsule size, phase change properties, thermal and chemical stability. To enhance the heat transfer within the microcapsules, GnP of 0.5, 1 and 3 wt% were incorporated. The performance of PCM was compared with a finned heat sink under constant heat load condition of 10 W, 15 W and 20 W. The performance was evaluated based on the heat sink base temperature with time for set point temperatures and the temperature rise rate (TRR). The thermal conductivity increased from 0.192 to 0.379 W/m K and the TRR of the heat sink was delayed due to the enhanced the heat transfer within the ME/GnP PCM. Moreover, the recovery time of the heat sink also declined due to reduced thermal resistance and n cleation effect in the MEPCM by the GnP.
引用
收藏
页码:237 / 249
页数:13
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