Optoelectronic Properties and Structural Characterization of GaN Thick Films on Different Substrates through Pulsed Laser Deposition

被引:16
作者
Wang, Wei-Kai [1 ]
Huang, Shih-Yung [2 ]
Jiang, Ming-Chien [3 ]
Wuu, Dong-Sing [3 ]
机构
[1] Da Yeh Univ, Dept Mat Sci & Engn, Changhua 51591, Taiwan
[2] Da Yeh Univ, Dept Ind Engn & Management, Changhua 51591, Taiwan
[3] Natl Chung Hsing Univ, Dept Mat Sci & Engn, Taichung 40227, Taiwan
来源
APPLIED SCIENCES-BASEL | 2017年 / 7卷 / 01期
关键词
GaN; pulsed laser deposition; transmission electron microscopy; EPITAXIAL-GROWTH; THERMAL-STABILITY; ALUMINUM NITRIDE; SAPPHIRE; LAYERS; TEMPERATURE; PHOTOLUMINESCENCE; MOBILITY; QUALITY; STRESS;
D O I
10.3390/app7010087
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Approximately 4-m-thick GaN epitaxial films were directly grown onto a GaN/sapphire template, sapphire, Si(111), and Si(100) substrates by high-temperature pulsed laser deposition (PLD). The influence of the substrate type on the crystalline quality, surface morphology, microstructure, and stress states was investigated by X-ray diffraction (XRD), photoluminescence (PL), atomic force microscopy (AFM), transmission electron microscopy (TEM), and Raman spectroscopy. Raman scattering spectral analysis showed a compressive film stress of -0.468 GPa for the GaN/sapphire template, whereas the GaN films on sapphire, Si(111), and Si(100) exhibited a tensile stress of 0.21, 0.177, and 0.081 GPa, respectively. Comparative analysis indicated the growth of very close to stress-free GaN on the Si(100) substrate due to the highly directional energetic precursor migration on the substrate's surface and the release of stress in the nucleation of GaN films during growth by the high-temperature (1000 degrees C) operation of PLD. Moreover, TEM images revealed that no significant GaN meltback (Ga-Si) etching process was found in the GaN/Si sample surface. These results indicate that PLD has great potential for developing stress-free GaN templates on different substrates and using them for further application in optoelectronic devices.
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页数:9
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