Effect of proton irradiation on thermal resistance and breakdown voltage of InAlN/GaN high electron mobility transistors

被引:6
作者
Anderson, Travis [1 ]
Koehler, Andrew [1 ]
Hwang, Ya-Hsi [2 ]
Hsieh, Yueh-Ling [2 ]
Li, Shun [2 ]
Ren, Fan [2 ]
Johnson, Jerry Wayne [3 ]
Pearton, Stephen J. [4 ]
机构
[1] Naval Res Lab, Washington, DC 20375 USA
[2] Univ Florida, Dept Chem Engn, Gainesville, FL 32611 USA
[3] IQE Inc, Taunton, MA 02780 USA
[4] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2014年 / 32卷 / 05期
关键词
ALGAN/GAN HEMTS; OPERATION; GAN;
D O I
10.1116/1.4891629
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
InAlN/GaN high electron mobility transistors were irradiated from the front side with 340 keV protons to a dose of 5 x 10(13) cm(-2). Raman thermography showed that the irradiated devices had higher channel temperatures than unirradiated control devices, but only by similar to 10% under typical biasing conditions. Accordingly, the irradiated devices have higher thermal resistance (400 degrees C/W) compared to reference devices (350 degrees C/W), based on the slope of the power versus channel temperature line. However, increases of 42% in off-state drain breakdown voltage (V-BR) and of >92% in critical voltage (V-cri) were observed for the proton irradiated HEMT. This is ascribed to the reduction of the peak electric field at the gate edges by similar to 50% through the introduction of negative trap charges created from vacancies generated by the proton irradiation. (C) 2014 American Vacuum Society.
引用
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页数:5
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