The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary

被引:8
作者
Li, Y [1 ]
Li, SX [1 ]
Li, GY [1 ]
机构
[1] Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2004年 / 372卷 / 1-2期
基金
中国国家自然科学基金;
关键词
cyclic deformation; grain boundary; copper bicrystal; crack tip; deformation band; persistent slip band;
D O I
10.1016/j.msea.2003.12.058
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Cyclic deformation of a copper bicrystal with perpendicular grain boundary (GB) has been performed at room temperature at a constant plastic strain amplitude of 1.5 x 10(-3). The dislocation structure evolution in typical deformation band (DB) as opposed to persistent slip bands (PSB) was observed by electron channelling contrast technique in the scanning electron microscope (SEM) at different cycles. It was found that a micro-crack nucleated preferentially at the interface between matrix and the second type of deformation band (DBII), the habit plane of which is close to the conventional kink plane {1 0 1}, in the vicinity of grain boundary (GB), and propagated along DBII. The dislocation structures of the transgranular and intergranular crack tip were also observed. The main dislocation structure near the crack tip is the cell structure. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:221 / 228
页数:8
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