Three-dimensional inline inspection for substrate warpage and ball grid array coplanarity using stereo vision

被引：6
作者：
Nakazawa, Takeshi [1 ]
Samara, Ayman [1 ]
机构：
[1] Intel Corp, Chandler, AZ 85226 USA
来源：
APPLIED OPTICS | 2014年 / 53卷 / 14期
关键词：
CAMERA CALIBRATION;
D O I：
10.1364/AO.53.003101
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
We present a method for full-field 3D measurement of substrate warpage and ball grid array coplanarity, which is suitable for inline back-end inspection and process monitoring. For evaluating the performance of the proposed system, the linearity between our system and a reference confocal microscope is studied by repeating measurements 35 times with a particular substrate sample ( 38 mm x 28.5 mm). The point-to-point correlation coefficient with 1 sigma between two methods is 0.968 +/- 0.002, and the 2 sigma difference is 25.15 +/- 0.20 mu m for warpage measurement. 1 sigma repeatability of the substrate warpage is 4.2 mu m. For BGA coplanarity inspection the bump level correlation coefficient is 0.957 +/- 0.001 and the 2 sigma difference is 28.79 +/- 0.14 mu m. 1 sigma repeatability of BGA coplanarity is 3.7 mu m. Data acquisition takes about 0.2 s for full field measurements. (C) 2014 Optical Society of America
引用
收藏
页码：3101 / 3109
页数：9
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