Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection

被引：15

作者：

Dong, H. Q. ^{[1
]}

Vuorinen, V. ^{[1
]}

Liu, X. W. ^{[2
]}

Laurila, T. ^{[1
]}

Li, J. ^{[1
]}

Paulasto-Krockel, M. ^{[1
]}

机构：

[1] Aalto Univ, Sch Elect Engn, Dept Elect Engn & Automat, Espoo, Finland

[2] Aalto Univ, Sch Chem Technol, Dept Mat Sci, Espoo 02601, Finland

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2016年 / 45卷 / 01期

关键词：

Au-20wt.%Sn/Ni; interfacial reaction; thermodynamic; nanoindentation; hardness; indentation modulus; AU-SN SOLDER; SYSTEM; ALLOYS;

D O I：

10.1007/s11664-015-4152-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the microstructural evolution and properties of Au-20wt.%Sn|Ni reaction couples were investigated from two perspectives: (1) by analyzing the microstructure of the as-soldered and aged samples, as well as (2) by measuring the mechanical properties of the intermetallic compounds formed within the reaction zone. The evolution of interfacial reaction products for both the as-soldered and aged interconnections was rationalized by using the experimental results in combination with assessed thermodynamic data from the Au-Ni-Sn system. Moreover, nanoindentation tests were implemented to measure the indentation modulus and hardness of the compounds formed at the interface. It was found that aging had a negligible influence on the elastic modulus and hardness of AuSn and Au5Sn, while the solubility of the third element significantly changed the indentation modulus and hardness of the intermetallic compounds.

引用

页码：566 / 575

页数：10

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