Diminishing of work hardening in electroformed polycrystalline copper with nano-sized and uf-sized twins

被引：88

作者：

Luo, Ji

Mei, Zhi

Tian, Wenhuai

Wang, Zhirui

机构：

[1] Univ Toronto, Dept Mat Sci & Engn, Toronto, ON M5S 3E4, Canada

[2] Univ Sci & Technol Beijing, Dept Mat Phys & Chem, Beijing 100083, Peoples R China

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 441卷 / 1-2期

关键词：

nano- and ultrafine-sized; twin; copper; mechanical properties; work hardening; dislocations; cell structures;

D O I：

10.1016/j.msea.2006.08.051

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The diminishing of strain hardening effect has been an important issue in understanding the special deformation mechanism in the nano- and ultrafine- (uf-)grained materials. The deformation of an electroformed polycrystalline pure copper with both nano- and uf-sized twins was performed by uniaxial tension. Strain hardening rate was studied using the Kocks-Mecking plot approach. Microstructure evolutions of the two-scale sized twins at different strain conditions were observed and compared by means of transmission electron microscopy. A link between the abnormal hardening rate and the deformation mode inside nano- and uf-sized twins was established, and the diminishing of the hardening rate is attributed to the enhanced creep tendency and premature recovery of the special microstructures. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：282 / 290

页数：9

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