Dielectric breakdown and discharge energy on printed circuit board

被引：1

作者：

Du, BX ^{[1
]}

Xiao, J ^{[1
]}

Zhang, XJ ^{[1
]}

机构：

[1] Tianjin Univ, Coll Elect Automat, Tianjin 300072, Peoples R China

来源：

PROCEEDINGS OF THE 2004 IEEE INTERNATIONAL CONFERENCE ON SOLID DIELECTRICS, VOLS 1 AND 2 | 2004年

关键词：

printed circuit board; discharge dielectric; breakdown; temperature; atmospheric pressure; electric field; reverse discharge; power spectrum density;

D O I：

10.1109/ICSD.2004.1350354

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

An investigation of the influences of the environmental factors on breakdown strengths, discharge energy, density of electric field associated with discharge occurring on surface printed circuit board were discussed. The PD characteristics and phenomena in an air cavity on the printed circuit board were also discussed. The environmental factors include sample temperature increasing from 23degreesC to 150degreesC and atmospheric pressure decreasing from 100 kPa to 1 kPa. The experiment was carried out by a 30 kV dc pulse voltage, with a frequency in the range of 50 Hz to 150 Hz, and electric stress in the range of 60 kV/mm to 300 kV/mm. The experimental results revealed that the environmental factors have a great influence on the breakdown strengths, discharge energy and surface electric field of the air cavity.

引用

页码：316 / 319

页数：4

共 3 条

[1] Bodega R, 2002, 2002 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, P685, DOI 10.1109/CEIDP.2002.1048889
[2] Temperature dependence of surface breakdown on printed circuit board
Du, BX
[J]. PROCEEDINGS: ELECTRICAL INSULATION CONFERENCE AND ELECTRICAL MANUFACTURING & COIL WINDING TECHNOLOGY CONFERENCE, 2003, : 167 - 170
[3] A GENERALIZED-APPROACH TO PARTIAL DISCHARGE MODELING
NIEMEYER, L
[J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 1995, 2 (04) : 510 - 528

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