Effects of latent damage of recrystallization on lead free solder joints

被引：15

作者：

Mayyas, Ahmad ^{[1
,2
]}

Qasaimeh, Awni ^{[3
]}

Borgesen, Peter ^{[4
]}

Meilunas, Michael ^{[5
]}

机构：

[1] Univ Calif Berkeley, TSRC, Berkeley, CA 94704 USA

[2] Univ Calif Berkeley, Lawrence Berkeley Natl Lab, Sustainable Energy Syst Grp, Berkeley, CA 94720 USA

[3] Tennessee Technol Univ, Dept Mfg & Engn Technol, Cookeville, TN 38505 USA

[4] SUNY Binghamton, Dept Syst Sci & Ind Engn, Binghamton, NY 13902 USA

[5] Universal Instruments Corp, Conklin, NY 13748 USA

来源：

MICROELECTRONICS RELIABILITY | 2014年 / 54卷 / 02期

关键词：

THERMOMECHANICAL FATIGUE; SN; RELIABILITY; BEHAVIOR; INTERCONNECTIONS; MICROSTRUCTURE; ORIENTATION; STRAIN; MODEL; LIFE;

D O I：

10.1016/j.microrel.2013.10.006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Recrystallization behavior and microstructure evolution during liquid-liquid thermal shock of lead free solder alloys have been investigated in this study. SAC305 (Sn-3.0Ag-0.5Cu) solder alloy was used as the base solder alloy in which 5 different pitch sizes of ball grid array (BGA) were cycled in liquid-liquid thermal shock with (0/100 degrees C) profile and almost zero dwell time. The results show that recrystallization takes place in all BGA assemblies regardless of pitch size, but at different times. However, the larger the pitch sizes the sooner recrystallization will take place. This partially due to strain magnitude difference between central and outer joints. Thus larger pitch size coupons were subjected to higher strain magnitude, especially corner joints and hence recrystallization takes place on these coupons earlier. Moreover, it was found that cracks usually start and extend along the recrystallized regions. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：447 / 456

页数：10

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