An investigation on diffusion bonding of Cu/Cu using various grain size of Ni interlayers at low temperature

被引：31

作者：

Lin, Tong ^{[1
]}

Li, Chun ^{[1
]}

Si, Xiaoqing ^{[1
]}

Li, Xinru ^{[2
]}

Yang, Bo ^{[1
]}

Feng, Jicai ^{[1
]}

Cao, Jian ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

[2] Harbin Inst Technol, Minist Educ, Key Lab Microsyst & Microstruct Mfg, Harbin 150080, Peoples R China

来源：

MATERIALIA | 2020年 / 14卷

基金：

中国国家自然科学基金;

关键词：

Nanostructured materials; Diffusion bonding; Copper; Low temperature; Abnormal grain growth; INDUCED RECRYSTALLIZATION; MECHANICAL-PROPERTIES; SURFACE-ROUGHNESS; BEHAVIOR; CU; MICROSTRUCTURE; KINETICS; IRON; TI;

D O I：

10.1016/j.mtla.2020.100882

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The diffusion behavior of the elements in the diffusion bonding based on nanostructured surface layer was studied, using the copper diffusion bonding as an example. The interlayer of nanograins and diffusion induced recrystallization zone along the interdiffusion vastly enhanced the copper diffusion, so that the bonding temperature could be lowered by more than 100 degrees C. It thus presents a novel strategy for obtaining reliable diffusion bonding joints at low temperature. In addition, abnormal grain growth in the nanostructured materials used for diffusion bonding was observed, and the growth mechanism was further clarified by introducing the stress, along with temperature.

引用

页数：7

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