Toward manufacturing low-cost, large-area electronics

被引：13

作者：

Chason, M. ^{[1
]}

Gamota, D. R. ^{[1
]}

Brazis, P. W., Jr. ^{[1
]}

Kalyanasundaram, K. ^{[1
]}

Zhang, J. ^{[1
]}

Lian, K. K. ^{[1
]}

Croswell, R. ^{[1
]}

机构：

[1] Motorola Inc, Schaumburg, IL 60196 USA

来源：

MRS BULLETIN | 2006年 / 31卷 / 06期

关键词：

electronic material; fluidics; microelectromechanical (MEMS); microelectronics; microstructure; organic;

D O I：

10.1557/mrs2006.121

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Developments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems. The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

引用

页码：471 / 475

页数：5

共 17 条

[1]

BORLAND WJ, 2001, CIRCUITREE MAR, P94

[2]

CHASON M, 2003, Patent No. 6649852

[3]

Coombs C. F., 2001, Printed Circuits Handbook

[4]

CROSWELL RT, 2002, IPC PRINTED CIRCUIT

[5]

CROSWELL RT, 2002, EL CIRC WORLD CONV, V9

[6]

Dalmia S, 2002, IEEE MTT S INT MICR, P1405, DOI 10.1109/MWSYM.2002.1012118

[7]

DUNN G, 2004, IPC PRINT CIRC EXP

[8]

ELIACIN M, 2004, Patent No. 6714105

[9]

Lawrence D, 2004, PRINTED ORGANIC AND MOLECULAR ELECTRONICS, P161, DOI 10.1007/978-1-4419-9074-7_3

[10]

LIAN K, 2003, APEX AN CA MARCH 31

← 1 2 →