3D Printing of Highly Pure Copper

被引：168

作者：

Tran, Thang Q. ^{[1
]}

Chinnappan, Amutha ^{[1
]}

Lee, Jeremy Kong Yoong ^{[1
]}

Nguyen Huu Loc ^{[2
]}

Tran, Long T. ^{[2
]}

Wang, Gengjie ^{[3
]}

Kumar, Vishnu Vijay ^{[1
]}

Jayathilaka, W. A. D. M. ^{[1
]}

Ji, Dongxiao ^{[1
]}

Doddamani, Mrityunjay ^{[4
]}

Ramakrishna, Seeram ^{[1
]}

机构：

[1] Natl Univ Singapore, Dept Mech Engn, 9 Engn Dr 1,EA-07-05, Singapore 117575, Singapore

[2] Ho Chi Minh City Univ Technol, VNUHCM, Fac Mech Engn, 268 Ly Thuong Kiet,Dist 10, Ho Chi Minh City 740400, Vietnam

[3] Nanjing Univ, Coll Engn & Appl Sci, Natl Lab Solid State Microstruct, Inst Mat Engn, Nanjing 210093, Jiangsu, Peoples R China

[4] Natl Inst Technol, Dept Mech Engn, Lightweight Mat Lab, Surathkal 575025, Karnataka, India

来源：

METALS | 2019年 / 9卷 / 07期

关键词：

copper; additive manufacturing; selective laser melting; electron beam melting; binder jetting; ultrasonic additive manufacturing; PROCESS PARAMETERS; INTERFACIAL CHARACTERIZATION; ULTRASONIC CONSOLIDATION; METALLIC COMPONENTS; SLM PARTS; LASER; FABRICATION; INK; MICROSTRUCTURE; COMPOSITES;

D O I：

10.3390/met9070756

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Copper has been widely used in many applications due to its outstanding properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. While 3D printing can o ff er many advantages from layer-by-layer fabrication, the 3D printing of highly pure copper is still challenging due to the thermal issues caused by copper's high conductivity. This paper presents a comprehensive review of recent work on 3D printing technology of highly pure copper over the past few years. The advantages and current issues of 3D printing methods are compared while di ff erent properties of copper parts printed by these methods are summarized. Finally, we provide several potential applications of the 3D printed copper parts and an overview of current developments that could lead to new improvements in this advanced manufacturing field.

引用

页数：24

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