Ion implantation -: Tool for fabrication of advanced 4H-SiC devices

被引:4
作者
Kalinina, EV [1 ]
Kholujanov, G
Gol'dberg, Y
Blank, T
Onushkin, G
Strel'chuk, A
Violina, G
Kossov, V
Yafaev, R
Hallén, A
Konstantinov, A
机构
[1] Ioffe Inst, RU-194021 St Petersburg, Russia
[2] Electrotech Univ, RU-199026 St Petersburg, Russia
[3] Electron Optron, RU-194223 St Petersburg, Russia
来源
SILICON CARBIDE AND RELATED MATERIALS 2001, PTS 1 AND 2, PROCEEDINGS | 2002年 / 389-3卷
关键词
defects; detector; diodes; ion implantation; pn junctions; SiC;
D O I
10.4028/www.scientific.net/MSF.389-393.835
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The possibilities for using of Al ion implanted p(+)n junctions for different 4H-SiC devices were investigated. It has been shown that a thin low resistivity p(+)-layers can be formed in 4H-SiC pure CVD epitaxial layers with Al ion implantation followed by short high temperature annealing. These layers provide for reduction of resistance in diode structures and the increase of the hole injection in forward direction in them. Al ion implanted p(+)nn(+) diode structures with differencial resistance of 3x10(-3) Omega cm(-2) were obtained. Also the advantages of shallow Al ion implanted p(+)n junctions for the detectors of UV radiation and alpha-particles were determined.
引用
收藏
页码:835 / 838
页数:4
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