Active joining of Ti-6Al-4V with electroplated Cu thin film

被引：10

作者：

Li, JH ^{[1
]}

Lin, RY ^{[1
]}

机构：

[1] Univ Cincinnati, Dept Chem & Mat Chem, Cincinnati, OH 45221 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2004年 / 381卷 / 1-2期

关键词：

infrared processing; Ti-6Al-4V; joint shear strength; intermetallic compounds; joining affected zone; Widmanstatten structure;

D O I：

10.1016/j.msea.2004.03.028

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Joining of Ti-6Al-4V with thin film copper fillers was developed using an active infrared processing technique. The process includes rapid infrared heating of the specimen to 1125 degreesC, and holding at that temperature for 60 s in flowing argon without vacuum, then followed by rapid cooling. The copper thin film filler was electroplated to various thicknesses: 1, 2,4 and 8 mum. Excellent wetting between copper and Ti-6Al-4V was observed in all joints. High joint shear strengths were obtained for all joints. The highest joint strength, 616 +/- 10 MPa, was obtained with 2 mum filler thickness. This joint strength is significantly higher than the shear strength of pure copper, 174 MPa, or Ti-6Al-4V 542 MPa. When the filler material was only 1 mun, the joint zone was not completely filled. X-ray diffraction analysis on the as fractured joint surface revealed the presence of intermetallic compounds when joined with 4 and 8 mum copper fillers but it disappeared when joined with 1 and 2 mum copper fillers. (C) 2004 Published by Elsevier B.V.

引用

页码：39 / 50

页数：12