Design and Fabrication of Three-dimensional Polymer Optical Waveguide-based Fan-in/out Device for Multicore Fibers

被引：1

作者：

Yamaguchi, Yuto ^{[1
]}

Yakabe, Sho ^{[2
]}

Ishigure, Takaaki ^{[3
]}

机构：

[1] Keio Univ, Grad Sch Sci & Technol, Yokohama, Kanagawa, Japan

[2] Sumitomo Elect Ind Ltd, Yokohama, Kanagawa, Japan

[3] Keio Univ, Fac Sci & Technol, Yokohama, Kanagawa, Japan

来源：

2022 IEEE CPMT SYMPOSIUM JAPAN (ICSJ) | 2022年

关键词：

multicore fiber; the Mosquito method; fan-in/out waveguide;

D O I：

10.1109/ICSJ55786.2022.10034708

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Compact and low-loss fan-in/-out waveguides are successfully fabricated using the Mosquito method, in which four cores vary their arrangement three-dimensionally from one end to the other and they are precisely aligned to couple to multicore fibers.

引用

页数：4

共 7 条

[1] Free-Space Coupling Optics for Multicore Fibers [J].

Klaus, Werner ;

Sakaguchi, Jun ;

Puttnam, Benjamin J. ;

Awaji, Yoshinari ;

Wada, Naoya ;

Kobayashi, Tetsuya ;

Watanabe, Masayuki .

IEEE PHOTONICS TECHNOLOGY LETTERS, 2012, 24 (21) :1902-1905

[2]

Ling YC, 2021, 2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)

[3]

Matsui H, 2019, 2019 IEEE 2ND BRITISH AND IRISH CONFERENCE ON OPTICS AND PHOTONICS (BICOP)

[4] Confirmation of core pitch accuracy of fiber bundle type fan-out for MCF [J].

Saito, Tsunetoshi ;

Watanabe, Kengo ;

Suematsu, Katsuki ;

Shiino, Masato .

2014 IEEE PHOTONICS SOCIETY SUMMER TOPICAL MEETING SERIES, 2014, :168-169

[5] Fabrication of a Graded-Index Circular-Core Polymer Parallel Optical Waveguide Using a Microdispenser for a High-Density Optical Printed Circuit Board [J].

Soma, Kazutomo ;

Ishigure, Takaaki .

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2013, 19 (02)

[6] Fan-in/out polymer optical waveguide for a multicore fiber fabricated using the Mosquito method [J].

Suganuma, Daisuke ;

Ishigure, Takaaki .

OPTICS EXPRESS, 2015, 23 (02) :1585-1593

[7]

Watanabe T, 2013, IEEE PHOTON CONF, P303, DOI 10.1109/IPCon.2013.6656427

← 1 →