Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

被引：119
作者：
Xu, Sha [1 ]
Chan, Yan Cheong [1 ]
Zhang, Kaili [2 ]
Yung, K. C. [3 ]
机构：
[1] City Univ Hong Kong, Dept Elect Engn, Kowloon Tong, Hong Kong, Peoples R China
[2] City Univ Hong Kong, Dept Mech & Biomed Engn, Kowloon Tong, Hong Kong, Peoples R China
[3] Hong Kong Polytech Univ, PCB Technol Ctr, Dept Ind & Syst Engn, Kowloon, Hong Kong, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2014年 / 595卷
关键词：
Lead-free solder; Carbon nanotube; IMC growth; Mechanical property; SN-AG-CU; SHEAR-STRENGTH; COMPOSITE SOLDER; ELECTROMIGRATION; MICROSTRUCTURE;
D O I：
10.1016/j.jallcom.2014.01.083
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
In this work, multi-walled carbon nanotubes (MWCNTs) with various weight percentages of 0.01 wt%, 0.05 wt%, 0.1 wt% were incorporated into Sn3.5Ag0.5Cu (SAC) solder matrix by mechanical blending followed by reflow process. The microstructure with interfacial intermetallics (IMCs) growth were investigated after aging at 100 degrees C and a current density of 1.2 x 10(4) A/cm(2) for 336 h. CNTs were found to be homogeneously dispersed into the solder matrix by EDX analysis. Experimental results revealed that microporosities existed in some areas of doped solders, which retarded the formation of Ag3Sn IMCs. The growth of IMCs for CNTs reinforced solders was less significantly than that of the plain solder, because CNTs affected the reaction mechanisms of both Cu5Sn6 and Cu3Sn at the anode side and alleviated IMCs growth and solder dissolution into Cu substrate at the cathode side. A slight decrease in melting temperature for CNT reinforced solders was found compared to that of the plain solder. The CNT doped solders demonstrated promising improved shear strength and hardness. (C) 2014 Elsevier B.V. All rights reserved.
引用
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页码：92 / 102
页数：11
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