THERMAL PERFORMANCE OF WICKLESS AND ORIENTATION INDEPENDENT THIN VAPOR CHAMBERS WITH WETTABILITY PATTERNED MICRO STRUCTURE

被引:3
作者
Liu, Tengqing [1 ]
Yan, Wentao [2 ]
Yang, Xin [1 ]
Wang, Shuangfeng [1 ]
机构
[1] South China Univ Technol, Sch Chem & Chem Engn, Key Lab Enhanced Heat Transfer & Energy Conservat, Minist Educ, Guangzhou, Peoples R China
[2] South China Univ Technol, Sch Elect Power Engn, Guangzhou, Peoples R China
来源
THERMAL SCIENCE | 2022年 / 26卷 / 05期
基金
中国国家自然科学基金;
关键词
wickless TVC; WPMS; laser etching; filling ratio; orientation independent; thermal performance; HEAT-PIPE; FABRICATION;
D O I
10.2298/TSCI211106017L
中图分类号
O414.1 [热力学];
学科分类号
摘要
The wettability patterned micro structure (WPMS) arrays by laser etching are proposed to enhance the thermal performance of wickless thin vapor chamber (TVC). The effects of filling ratio and inclination angle on the thermal performance of wickless TVC with WPMS are investigated, and the untreated bare wickless TVC is also studied as comparison. The results show that the wickless TVC with WPMS can work stably at filling ratio ranging from 19.0% to 42.8%, and the optimum filling ratio is 42.8%. The maximum heat transfer capacity is 190 W with the lowest thermal resistance of 0.146 K/W. Since WPMS is superhydrophilic, it can provide nucleate sites to promote early onset nucleate boiling and capillary pressure to enhance the liquid supply. Thus, the wickless TVC with WPMS shows 10.98% lower thermal resistance and 18.75% higher maximum heat transfer capacity than that of the untreated bare wickless TVC. In addition, the thermal performance of wickless TVC with WPMS is insensitive to the orientation of the TVC.
引用
收藏
页码:4391 / 4400
页数:10
相关论文
共 18 条
[1]   A Review of Vapor Chambers [J].
Bulut, Murat ;
Kandlikar, Satish G. ;
Sozbir, Nedim .
HEAT TRANSFER ENGINEERING, 2019, 40 (19) :1551-1573
[2]   Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices [J].
Chen, Zhaoshu ;
Li, Yong ;
Zhou, Wenjie ;
Deng, Liqiang ;
Yan, Yuying .
ENERGY CONVERSION AND MANAGEMENT, 2019, 187 :221-231
[3]   A review of heat pipe technology for foldable electronic devices [J].
Gibbons, Michael J. ;
Marengo, Marco ;
Persoons, Tim .
APPLIED THERMAL ENGINEERING, 2021, 194
[4]   A new ultra-thin vapor chamber with composite wick for thin electronic products [J].
Huang, Guangwen ;
Liu, Wangyu ;
Luo, Yuanqiang ;
Li, Yong ;
Chen, Hanyin .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2021, 170
[5]   A novel ultra-thin vapor chamber for heat dissipation in ultra-thin portable electronic devices [J].
Huang, Guangwen ;
Liu, Wangyu ;
Luo, Yuanqiang ;
Li, Yong .
APPLIED THERMAL ENGINEERING, 2020, 167
[6]   Metal 3D-printed wick structures for heat pipe application: Capillary performance analysis [J].
Jafari, Davoud ;
Wits, Wessel W. ;
Geurts, Bernard J. .
APPLIED THERMAL ENGINEERING, 2018, 143 :403-414
[7]   Design, fabrication, and performance evaluation of a novel orientation independent and wickless heat spreader [J].
Kumar, Nirbhay ;
Sinha, Kumar Nishant Ranjan ;
Raza, Md Qaisar ;
Verma, Ashwani ;
Seth, Debabrata ;
Jasvanth, V. S. ;
Raj, Rishi .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2020, 153
[8]   Fabrication and characterization of pure-metal-based submillimeter-thick flexible flat heat pipe with innovative wick structures [J].
Lee, Daehoon ;
Byon, Chan .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2018, 122 :306-314
[9]   Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips [J].
Li, Ji ;
Lv, Lucang ;
Zhou, Guohui ;
Li, Xingping .
ENERGY CONVERSION AND MANAGEMENT, 2019, 201
[10]   REVIEW OF VARIOUS THIN HEAT SPREADER VAPOR CHAMBER DESIGNS, PERFORMANCE, LIFETIME RELIABILITY AND APPLICATION [J].
Mochizuki, Masataka ;
Thang Nguyen .
FRONTIERS IN HEAT AND MASS TRANSFER, 2019, 13