Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

被引：15

作者：

Zhang, X. F. ^{[1
]}

Guo, J. D. ^{[1
]}

Shang, J. K. ^{[1
,2
]}

机构：

[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China

[2] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2009年 / 38卷 / 03期

关键词：

Electromigration; coupling effect; polarity; intermetallic compound; interfacial reaction; ZN BASED SOLDERS; NI-P/AU LAYER; CROSS-INTERACTION; INTERMETALLIC COMPOUNDS; BUMP METALLIZATION; EUTECTIC SNPB; SN-9ZN SOLDER; CU; JOINTS; COMBINATION;

D O I：

10.1007/s11664-008-0594-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 x 10(4) A/cm(2) for 168.5 h at 150A degrees C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu6Sn5 phase replaced the Ni5Zn21 phase at the Ni/Sn-Zn interface, whereas at the Cu/Sn-Zn interface, a thicker beta-CuZn phase replaced the Cu5Zn8 phase.

引用

页码：425 / 429

页数：5

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