Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

被引：13
|
作者：
Zhang, X. F. [1 ]
Guo, J. D. [1 ]
Shang, J. K. [1 ,2 ]
机构：
[1] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
[2] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2009年 / 38卷 / 03期
关键词：
Electromigration; coupling effect; polarity; intermetallic compound; interfacial reaction; ZN BASED SOLDERS; NI-P/AU LAYER; CROSS-INTERACTION; INTERMETALLIC COMPOUNDS; BUMP METALLIZATION; EUTECTIC SNPB; SN-9ZN SOLDER; CU; JOINTS; COMBINATION;
D O I：
10.1007/s11664-008-0594-1
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Electromigration in the Ni/Sn-Zn/Cu solder interconnect was studied with an average current density of 3.51 x 10(4) A/cm(2) for 168.5 h at 150A degrees C. When the electrons flowed from the Ni side to the Cu side, uniform layers of Ni5Zn21 and Cu5Zn8 were formed at the Ni/Sn-Zn and Cu/Sn-Zn interfaces. However, upon reversing the current direction, where electron flow was from the Cu side to the Ni side, a thicker Cu6Sn5 phase replaced the Ni5Zn21 phase at the Ni/Sn-Zn interface, whereas at the Cu/Sn-Zn interface, a thicker beta-CuZn phase replaced the Cu5Zn8 phase.
引用
收藏
页码：425 / 429
页数：5
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