Comparison of CH, C3, CHF, and CF2 Surface Reactivities during Plasma-Enhanced Chemical Vapor Deposition of Fluorocarbon Films

被引:10
作者
Liu, Dongping [1 ]
Cuddy, Michael F. [1 ]
Fisher, Ellen R. [1 ]
机构
[1] Colorado State Univ, Dept Chem, Ft Collins, CO 80523 USA
基金
美国国家科学基金会;
关键词
surface interactions; plasma modification; fluorocarbon polymers; laser-induced fluorescence; optical emission spectroscopy; LASER-INDUCED FLUORESCENCE; HEXAFLUOROPROPYLENE OXIDE; THIN-FILMS; LIFETIME MEASUREMENTS; SILICON-NITRIDE; CONTINUOUS-WAVE; RADICALS; GROWTH; ION; 1,1,2,2-TETRAFLUOROETHANE;
D O I
10.1021/am900034x
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The overall character of films deposited using plasma-enhanced chemical vapor deposition relies on the interactions of gas-phase molecules with the depositing film surface. The steady-state surface interactions of CH, C-3, CHF, and CF2 have been characterized at the interface of depositing fluorocarbon (FC) films using the imaging of radicals interacting with surfaces (IRIS) technique. IRIS measurements show that the relative gas-phase densities of CH, C-3, CHF, and CF2 in mixed FC plasmas depend on the CH2F2/C3F8 ratio. Similar results are found using optical emission spectroscopy to monitor the production of excited-state plasma species. The effects of plasma parameters, such as the feed gas composition and substrate bias on the radical surface, were measured. Under all conditions, the surface reactivity for CH radicals is near unity, whereas those for C-3, CHF, and CF2 exhibit very low surface reactivity but also show some dependence on experimental parameters. Under some conditions, CF2 and CHF are generated at the surface of the depositing him. Surface reactivity measurements indicate that CF2, CHF, and C-3 may contribute to FC growth only when adsorbing at reactive sites at the film surface. Moreover, the low surface reactivities of singlet species such as C-3, CF2, and CHF may be related to the electronic configuration of the molecules.
引用
收藏
页码:934 / 943
页数:10
相关论文
共 42 条
[31]   Effect of Ag loading content on morphology and photocatalytic activity of Ag-TiO2 nanoparticulate films prepared via simultaneous plasma-enhanced chemical and physical vapor deposition [J].
Jiang, Dianping ;
Kusdianto, K. ;
Kubo, Masaru ;
Shimada, Manabu .
MATERIALS RESEARCH EXPRESS, 2020, 7 (11)
[32]   Influence of Ar/H2 ratio on the characteristics of phosphorus-doped hydrogenated nanocrystalline silicon films prepared by electron cyclotron resonance plasma-enhanced chemical vapor deposition [J].
Zhang, Xueyu ;
Wu, Aimin ;
Shi, Shaofei ;
Qin, Fuwen ;
Bian, Jiming .
THIN SOLID FILMS, 2012, 521 :181-184
[33]   UV-Protective TiO2 Thin Films with High Transparency in Visible Light Region Fabricated via Atmospheric-Pressure Plasma-Enhanced Chemical Vapor Deposition [J].
Xu, Jing ;
Nagasawa, Hiroki ;
Kanezashi, Masakoto ;
Tsuru, Toshinori .
ACS APPLIED MATERIALS & INTERFACES, 2018, 10 (49) :42657-42665
[34]   Epitaxial Growth and Solar-Blind Photoelectric Characteristic of Ga2O3 Film on Various Oriented Sapphire Substrates by Plasma-Enhanced Chemical Vapor Deposition [J].
Hu, Haizheng ;
Wu, Chao ;
Zhao, Nie ;
Zhu, Zhiyan ;
Li, Peigang ;
Wang, Shunli ;
Tang, Weihua ;
Guo, Daoyou .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2021, 218 (11)
[35]   Influence of Ar/H2 ratio on the characteristics of boron-doped nc-Si:H films prepared by electron cyclotron resonance plasma-enhanced chemical vapor deposition [J].
Zhang, Xueyu ;
Wu, Aimin ;
Shi, Shaofei ;
Qin, Fuwen .
SURFACE & COATINGS TECHNOLOGY, 2013, 228 :S412-S415
[36]   Different Crystal Growth Mechanisms of Si(001)-(2 x 1):H during Plasma-Enhanced Chemical Vapor Deposition of SiH3 and SiH2 Radicals: Tight-Binding Quantum Chemical Molecular Dynamics Simulations [J].
Kuwahara, Takuya ;
Ito, Hiroshi ;
Kawaguchi, Kentaro ;
Higuchi, Yuji ;
Ozawa, Nobuld ;
Kubo, Momoji .
JOURNAL OF PHYSICAL CHEMISTRY C, 2013, 117 (30) :15602-15614
[37]   EFFECTS OF ANNEALING IN O-2 AND N-2 ON THE ELECTRICAL-PROPERTIES OF TANTALUM OXIDE THIN-FILMS PREPARED BY ELECTRON-CYCLOTRON-RESONANCE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION [J].
KIM, IL ;
KIM, JS ;
KWON, OS ;
AHN, ST ;
CHUN, JS ;
LEE, WJ .
JOURNAL OF ELECTRONIC MATERIALS, 1995, 24 (10) :1435-1441
[38]   Plasma-enhanced chemical vapor deposition for fabrication of yolk-shell SnO2@Void@C nanowires, as an efficient carbon coating technique for improving lithium-ion battery performance [J].
Habibi, Alireza ;
Mousavi, Mir Razi ;
Yasoubi, Mohammadreza ;
Sanaee, Zeinab ;
Ghasemi, Shahnaz .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2022, 149
[39]   Effect of N2 Gas Flow Ratio in Plasma-Enhanced Chemical Vapor Deposition with SiH4-NH3-N2-He Gas Mixture on Stress Relaxation of Silicon Nitride [J].
Murata, Tatsunori ;
Miyagawa, Yoshihiro ;
Matsuura, Masazumi ;
Asai, Koyu ;
Miyatake, Hiroshi .
JAPANESE JOURNAL OF APPLIED PHYSICS, 2010, 49 (08)
[40]   Investigations on the Role of N2:(N2 + CH4) Ratio on the Growth of Hydrophobic Nanostructured Hydrogenated Carbon Nitride Thin Films by Plasma Enhanced Chemical Vapor Deposition at Low Temperature [J].
Khanis, Noor Hamizah ;
Ritikos, Richard ;
Ahmad Kamal, Shafarina Azlinda ;
Abdul Rahman, Saadah .
MATERIALS, 2017, 10 (02)