Investigation of the grinding temperature and energy partition during cylindrical grinding

In this study, the distribution of temperature and energy under the process parameter conditions and thermal physical parameters are investigated using a physics-based model via the finite element modeling (FEM) simulation and experimental validation during cylindrical grinding. A cylindrical grinding model is modeled to simulate the chip removal behavior in the grinding process and to measure the workpiece and chip temperatures by refining the temperature field. Workpiece speed affects the energy partition into chip more obviously than other grinding parameters. Reasonable selection of grinding parameters greatly reduces the energy partition into the workpiece from 80% to 50-30% or even lower. This study offers a comprehensive understanding of heating mechanisms during grinding and thus is very beneficial for process optimization.