High-quality high-throughput silicon laser milling using a 1 kW sub-picosecond laser

被引：22

作者：

Holder, Daniel ^{[1
]}

Weber, Rudolf ^{[1
]}

Roecker, Christoph ^{[1
]}

Kunz, Gerhard ^{[2
]}

Bruneel, David ^{[3
]}

Delaigue, Martin ^{[4
]}

Graf, Thomas ^{[1
]}

Ahmed, Marwan Abdou ^{[1
]}

机构：

[1] Univ Stuttgart, Inst Strahlwerkzeuge IFSW, Pfaffenwaldring 43, D-70569 Stuttgart, Germany

[2] Robert Bosch GmbH, Robert Bosch Campus 1, D-71272 Renningen, Germany

[3] Lasea, Rue Chasseurs Ardennais 10, B-4031 Angleur, Belgium

[4] Amplitude Syst, 11 Ave Canteranne, F-33600 Pessac, France

来源：

OPTICS LETTERS | 2021年 / 46卷 / 02期

关键词：

HEAT ACCUMULATION; ABLATION;

D O I：

10.1364/OL.411412

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

We report on high-quality high-throughput laser milling of silicon with a sub-ps laser delivering more than 1 kW of average laser power on the workpiece. In order to avoid heat accumulation effects, the processing strategy for high-quality laser milling was adapted to the available average power by using five-pulse bursts, a large beam diameter of 372 mu m to limit the peak fluence per pulse to approximately 0.7 J/cm(2), and a high feed rate of 24 m/s. As a result, smooth surfaces with a low roughness of S-a <= 0.6 mu m were achieved up to the investigated milling depth of 313 mu m while maintaining a high material removal rate of 230 mm(3)/min. (C) 2021 Optical Society of America

引用

页码：384 / 387

页数：4

共 20 条

[1] Heat accumulation in ultra-short pulsed scanning laser ablation of metals [J].

Bauer, Franziska ;

Michalowski, Andreas ;

Kiedrowski, Thomas ;

Nolte, Stefan .

OPTICS EXPRESS, 2015, 23 (02) :1035-1043

[2] Systematic study of laser ablation with GHz bursts of femtosecond pulses [J].

Bonamis, Guillaume ;

Audouard, Eric ;

Honninger, Clemens ;

Lopez, John ;

Mishchik, Konstantin ;

Mottay, Eric ;

Manek-Honninger, Inka .

OPTICS EXPRESS, 2020, 28 (19) :27702-27714

[3] Femtosecond laser ablation of silicon-modification thresholds and morphology [J].

Bonse, J ;

Baudach, S ;

Krüger, J ;

Kautek, W ;

Lenzner, M .

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2002, 74 (01) :19-25

[4] Ultrafast thin-disk multi-pass amplifier system providing 1.9 kW of average output power and pulse energies in the 10 mJ range at 1 ps of pulse duration for glass-cleaving applications [J].

Dietz, Thomas ;

Jenne, Michael ;

Bauer, Dominik ;

Scharun, Michael ;

Sutter, Dirk ;

Killi, Alexander .

OPTICS EXPRESS, 2020, 28 (08) :11415-11423

[5] Scaling the productivity of laser structuring processes using picosecond laser pulses at average powers of up to 420 W to produce superhydrophobic surfaces on stainless steel AISI 316L [J].

Faas, Sebastian ;

Bielke, Uwe ;

Weber, Rudolf ;

Graf, Thomas .

SCIENTIFIC REPORTS, 2019, 9 (1)

[6] High-quality processing of CFRP with a 1.1-kW picosecond laser [J].

Freitag, Christian ;

Wiedenmann, Margit ;

Negel, Jan-Philipp ;

Loescher, Andre ;

Onuseit, Volkher ;

Weber, Rudolf ;

Ahmed, Marwan Abdou ;

Graf, Thomas .

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2015, 119 (04) :1237-1243

[7] Laser micromachining for manufacturing MEMS devices [J].

Gower, M .

MEMS COMPONENTS AND APPLICATIONS FOR INDUSTRY, AUTOMOBILES, AEROSPACE, AND COMMUNICATION, 2001, 4559 :53-59

[8] Laser-Ablated Silicon in the Frequency Range From 0.1 to 4.7 THz [J].

Indrisiunas, Simonas ;

Svirplys, Evaldas ;

Richter, Heiko ;

Urbanowicz, Andrzej ;

Raciukaitis, Gediminas ;

Hagelschuer, Till ;

Huebers, Heinz-Wilhelm ;

Kasalynas, Irmantas .

IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2019, 9 (06) :581-586

[9] Physics of picosecond pulse laser ablation [J].

Keller, Wesley J. ;

Shen, Nan ;

Rubenchik, Alexander M. ;

Ly, Sonny ;

Negres, Raluca ;

Raman, Rajesh N. ;

Yoo, Jae-Hyuck ;

Guss, Gabe ;

Stolken, James S. ;

Matthews, Manyalibo J. ;

Bude, Jeff D. .

JOURNAL OF APPLIED PHYSICS, 2019, 125 (08)

[10] Scaling ablation rates for picosecond lasers using burst micromachining [J].

Knappe, Ralf ;

Haloui, Hatim ;

Seifert, Albert ;

Weis, Alexander ;

Nebel, Achim .

LASER-BASED MICRO- AND NANOPACKAGING AND ASSEMBLY IV, 2010, 7585

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